M27C1024-70XF6X
vs
M27C1024-70F7X
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
DIP
DIP
Package Description
WINDOWED, FRIT SEALED, CERAMIC, DIP-40
WINDOWED, FRIT SEALED, CERAMIC, DIP-40
Pin Count
40
40
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
70 ns
70 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-GDIP-T40
R-GDIP-T40
JESD-609 Code
e3
e3
Length
52.195 mm
52.195 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
40
40
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64KX16
64KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
WDIP
WDIP
Package Equivalence Code
DIP40,.6
DIP40,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.97 mm
5.97 mm
Standby Current-Max
0.0001 A
0.0001 A
Supply Current-Max
0.035 mA
0.035 mA
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
1
1
Compare M27C1024-70XF6X with alternatives
Compare M27C1024-70F7X with alternatives