M27C1024-70XF6X vs AM27C1024-70DC feature comparison

M27C1024-70XF6X STMicroelectronics

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AM27C1024-70DC AMD

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS ADVANCED MICRO DEVICES INC
Part Package Code DIP DIP
Package Description WINDOWED, FRIT SEALED, CERAMIC, DIP-40 DIP, DIP40,.6
Pin Count 40 40
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 70 ns 70 ns
I/O Type COMMON COMMON
JESD-30 Code R-GDIP-T40 R-CDIP-T40
JESD-609 Code e3 e0
Length 52.195 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type UVPROM UVPROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 40 40
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 64KX16 64KX16
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code WDIP DIP
Package Equivalence Code DIP40,.6 DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.97 mm
Standby Current-Max 0.0001 A 0.0001 A
Supply Current-Max 0.035 mA 0.05 mA
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 1 3

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Compare AM27C1024-70DC with alternatives