M27C1024-70XF3X
vs
AM27C1024-70DIB
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
SPANSION INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
WINDOWED, FRIT SEALED, CERAMIC, DIP-40
|
DIP,
|
Pin Count |
40
|
40
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.61
|
8542.32.00.61
|
Access Time-Max |
70 ns
|
70 ns
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-GDIP-T40
|
R-CDIP-T40
|
JESD-609 Code |
e3
|
|
Length |
52.195 mm
|
52.26 mm
|
Memory Density |
1048576 bit
|
1048576 bit
|
Memory IC Type |
UVPROM
|
UVPROM
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
40
|
40
|
Number of Words |
65536 words
|
65536 words
|
Number of Words Code |
64000
|
64000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
64KX16
|
64KX16
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
WDIP
|
DIP
|
Package Equivalence Code |
DIP40,.6
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE, WINDOW
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.97 mm
|
5.588 mm
|
Standby Current-Max |
0.0001 A
|
|
Supply Current-Max |
0.035 mA
|
0.05 mA
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
15.24 mm
|
15.24 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare M27C1024-70XF3X with alternatives
Compare AM27C1024-70DIB with alternatives