M27C1024-70F3X vs NM27LV210V300 feature comparison

M27C1024-70F3X STMicroelectronics

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NM27LV210V300 National Semiconductor Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description WINDOWED, FRIT SEALED, CERAMIC, DIP-40 QCCJ, LDCC44,.7SQ
Pin Count 40
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 70 ns 300 ns
I/O Type COMMON COMMON
JESD-30 Code R-GDIP-T40 S-PQCC-J44
JESD-609 Code e3 e0
Length 52.195 mm 16.51 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type UVPROM UVPROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 40 44
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -40 °C
Organization 64KX16 64KX16
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code WDIP QCCJ
Package Equivalence Code DIP40,.6 LDCC44,.7SQ
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE, WINDOW CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.97 mm 4.57 mm
Standby Current-Max 0.0001 A 0.00002 A
Supply Current-Max 0.035 mA 0.02 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE COMMERCIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form THROUGH-HOLE J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 15.24 mm 16.51 mm
Base Number Matches 1 1

Compare M27C1024-70F3X with alternatives

Compare NM27LV210V300 with alternatives