Part Details for M27C1024-70F3X by STMicroelectronics
Overview of M27C1024-70F3X by STMicroelectronics
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (9 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for M27C1024-70F3X
M27C1024-70F3X CAD Models
M27C1024-70F3X Part Data Attributes
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M27C1024-70F3X
STMicroelectronics
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Datasheet
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M27C1024-70F3X
STMicroelectronics
64KX16 UVPROM, 70ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | STMICROELECTRONICS | |
Part Package Code | DIP | |
Package Description | WINDOWED, FRIT SEALED, CERAMIC, DIP-40 | |
Pin Count | 40 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 70 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-GDIP-T40 | |
JESD-609 Code | e3 | |
Length | 52.195 mm | |
Memory Density | 1048576 bit | |
Memory IC Type | UVPROM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Terminals | 40 | |
Number of Words | 65536 words | |
Number of Words Code | 64000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 64KX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Equivalence Code | DIP40,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.97 mm | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.035 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | MATTE TIN | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for M27C1024-70F3X
This table gives cross-reference parts and alternative options found for M27C1024-70F3X. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27C1024-70F3X, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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AT27HC1024-70DM | Atmel Corporation | Check for Price | UVPROM, 64KX16, 70ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40 | M27C1024-70F3X vs AT27HC1024-70DM |
5962-8680508QX | Atmel Corporation | Check for Price | UVPROM, 64KX16, 70ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40 | M27C1024-70F3X vs 5962-8680508QX |
AM27C1024-70DIB | Spansion | Check for Price | UVPROM, 64KX16, 70ns, CMOS, CDIP40, CERAMIC, DIP-40 | M27C1024-70F3X vs AM27C1024-70DIB |
AM27C1024-70DC | Spansion | Check for Price | UVPROM, 64KX16, 70ns, CMOS, CDIP40, CERAMIC, DIP-40 | M27C1024-70F3X vs AM27C1024-70DC |
M27C1024-70XF7X | STMicroelectronics | Check for Price | 64KX16 UVPROM, 70ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40 | M27C1024-70F3X vs M27C1024-70XF7X |
AT27HC1024-70DM/883 | Atmel Corporation | Check for Price | UVPROM, 64KX16, 70ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40 | M27C1024-70F3X vs AT27HC1024-70DM/883 |
AM27C1024-70DCB | Spansion | Check for Price | UVPROM, 64KX16, 70ns, CMOS, CDIP40, CERAMIC, DIP-40 | M27C1024-70F3X vs AM27C1024-70DCB |
5962-8680508QX | Teledyne e2v | Check for Price | UVPROM, 64KX16, 70ns, CMOS, CDIP40, | M27C1024-70F3X vs 5962-8680508QX |
M27C1024-70XF6X | STMicroelectronics | Check for Price | 64KX16 UVPROM, 70ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40 | M27C1024-70F3X vs M27C1024-70XF6X |