M2732AF1 vs MD2732A-25 feature comparison

M2732AF1 STMicroelectronics

Buy Now Datasheet

MD2732A-25 Intel Corporation

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS INTEL CORP
Part Package Code DIP DIP
Package Description WINDOWED, FRIT SEALED, CERAMIC, DIP-24 CERAMIC, DIP-24
Pin Count 24 24
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Samacsys Manufacturer STMicroelectronics
Access Time-Max 250 ns 250 ns
Additional Feature 21V PROGRAMMING VOLTAGE
I/O Type COMMON COMMON
JESD-30 Code R-GDIP-T24 R-CDIP-T24
JESD-609 Code e0 e0
Length 31.75 mm
Memory Density 32768 bit 32768 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4KX8 4KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP24,.6 DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 21 V 21 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.715 mm
Supply Current-Max 0.125 mA 0.115 mA
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology NMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 1 1
Screening Level 38535Q/M;38534H;883B

Compare M2732AF1 with alternatives

Compare MD2732A-25 with alternatives