M25PX64SOVZM6TBA
vs
W25Q64FVSSIF
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
WINBOND ELECTRONICS CORP
Package Description
6 X 8 MM, ROHS COMPLIANT, TBGA-24
SOIC-8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
75 MHz
104 MHz
JESD-30 Code
R-PBGA-B24
S-PDSO-G8
Length
8 mm
5.28 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
8
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX8
8MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
SOP
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY, THIN PROFILE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
2.7 V
3 V
Seated Height-Max
1.2 mm
2.16 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
3 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
DUAL
Width
6 mm
5.28 mm
Base Number Matches
1
1
Samacsys Manufacturer
Winbond
Alternate Memory Width
1
Data Retention Time-Min
20
Output Characteristics
3-STATE
Package Equivalence Code
SOP8,.3
Qualification Status
Not Qualified
Serial Bus Type
SPI
Standby Current-Max
0.00005 A
Write Protection
HARDWARE/SOFTWARE
Compare M25PX64SOVZM6TBA with alternatives
Compare W25Q64FVSSIF with alternatives