M25PX64SOVZM6G
vs
M25PX64SVZM3E
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Package Description
BGA, BGA24,5X5,40
6 X 8 MM, ROHS COMPLIANT, TBGA-24
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
75 MHz
75 MHz
Endurance
100000 Write/Erase Cycles
JESD-30 Code
S-PBGA-B24
R-PBGA-B24
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX8
8MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
TBGA
Package Equivalence Code
BGA24,5X5,40
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Serial Bus Type
SPI
Standby Current-Max
0.00001 A
Supply Current-Max
0.015 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
Write Protection
HARDWARE/SOFTWARE
Base Number Matches
2
1
Length
8 mm
Programming Voltage
2.7 V
Seated Height-Max
1.2 mm
Width
6 mm
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