M25PX64SOVME6EA vs W25X64VZEIZ feature comparison

M25PX64SOVME6EA Micron Technology Inc

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W25X64VZEIZ Winbond Electronics Corp

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC WINBOND ELECTRONICS CORP
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Memory IC Type FLASH FLASH
Programming Voltage 2.7 V 3 V
Base Number Matches 1 1
Rohs Code Yes
Part Package Code SON
Package Description SON, SOLCC8,.25
Pin Count 8
Clock Frequency-Max (fCLK) 33 MHz
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PDSO-N8
Length 8 mm
Memory Density 67108864 bit
Memory Width 8
Number of Functions 1
Number of Terminals 8
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 8MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code SON
Package Equivalence Code SOLCC8,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Serial Bus Type SPI
Standby Current-Max 0.00001 A
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE
Width 6 mm
Write Protection HARDWARE/SOFTWARE

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Compare W25X64VZEIZ with alternatives