M25P80SVMW3TGB vs W25X80VSSIZ feature comparison

M25P80SVMW3TGB Micron Technology Inc

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W25X80VSSIZ Winbond Electronics Corp

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC WINBOND ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description SOP, 0.208 INCH, ROHS COMPLIANT, PLASTIC, SOIC-8
Pin Count 8 8
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 75 MHz 33 MHz
JESD-30 Code R-PDSO-G8 S-PDSO-G8
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX8 1MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 2.7 V 3 V
Seated Height-Max 2.5 mm 2.16 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Width 5.62 mm 5.27 mm
Base Number Matches 1 1
Additional Feature SYNCHRONOUS MODE ALSO POSSIBLE
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-609 Code e3
Length 5.27 mm
Moisture Sensitivity Level 3
Output Characteristics 3-STATE
Package Equivalence Code SOP8,.3
Qualification Status Not Qualified
Serial Bus Type SPI
Standby Current-Max 0.00001 A
Supply Current-Max 0.025 mA
Supply Voltage-Nom (Vsup) 3 V
Terminal Finish MATTE TIN
Write Protection HARDWARE/SOFTWARE

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