W25X80VSSIZ vs F25L08PA-100PAIG feature comparison

W25X80VSSIZ Winbond Electronics Corp

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F25L08PA-100PAIG Elite Semiconductor Memory Technology Inc

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Rohs Code Yes
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer WINBOND ELECTRONICS CORP ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC
Part Package Code SOIC SOIC
Package Description 0.208 INCH, ROHS COMPLIANT, PLASTIC, SOIC-8 0.200 INCH, ROHS COMPLIANT, SOIC-8
Pin Count 8 8
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Additional Feature SYNCHRONOUS MODE ALSO POSSIBLE
Clock Frequency-Max (fCLK) 33 MHz 100 MHz
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-30 Code S-PDSO-G8 R-PDSO-G8
JESD-609 Code e3
Length 5.27 mm 5.28 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX8 1MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP8,.3 SOP8,.3
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.16 mm 2.16 mm
Serial Bus Type SPI
Standby Current-Max 0.00001 A
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 3 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Width 5.27 mm 5.23 mm
Write Protection HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 1 1

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