M25P64-VME3GB
vs
W25Q64CVZEJP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NUMONYX
WINBOND ELECTRONICS CORP
Part Package Code
DFP
Package Description
SON,
HVSON,
Pin Count
8
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
kg CO2e/kg
12
Average Weight (mg)
386.2
CO2e (mg)
4634.4
Category CO2 Kg
12
Compliance Temperature Grade
Automotive: -40C to +125C
Clock Frequency-Max (fCLK)
75 MHz
80 MHz
JESD-30 Code
R-PDSO-N8
R-PDSO-N8
Length
10.3 mm
8 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX8
8MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SON
HVSON
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial
PARALLEL
SERIAL
Programming Voltage
2.7 V
3 V
Qualification Status
Not Qualified
Seated Height-Max
2.65 mm
0.8 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
Width
7.5 mm
6 mm
Base Number Matches
2
1
Samacsys Manufacturer
Winbond
Output Characteristics
3-STATE
Screening Level
AEC-Q100
Supply Voltage-Nom (Vsup)
3 V
Compare M25P64-VME3GB with alternatives
Compare W25Q64CVZEJP with alternatives