M25P10-AVMB3G/X
vs
W25X80ALSSIG
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NUMONYX
|
WINBOND ELECTRONICS CORP
|
Part Package Code |
DFP
|
SOIC
|
Package Description |
,
|
0.208 INCH, GREEN, PLASTIC, SOIC-8
|
Pin Count |
8
|
8
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
JESD-30 Code |
R-XDSO-N8
|
S-PDSO-G8
|
Memory IC Type |
FLASH
|
FLASH
|
Number of Terminals |
8
|
8
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Programming Voltage |
2.7 V
|
3 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
1
|
Rohs Code |
|
Yes
|
Clock Frequency-Max (fCLK) |
|
50 MHz
|
Data Retention Time-Min |
|
20
|
Endurance |
|
100000 Write/Erase Cycles
|
Length |
|
5.28 mm
|
Memory Density |
|
8388608 bit
|
Memory Width |
|
8
|
Number of Functions |
|
1
|
Number of Words |
|
1048576 words
|
Number of Words Code |
|
1000000
|
Operating Mode |
|
SYNCHRONOUS
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
|
1MX8
|
Output Characteristics |
|
3-STATE
|
Package Code |
|
SOP
|
Package Equivalence Code |
|
SOP8,.3
|
Parallel/Serial |
|
SERIAL
|
Seated Height-Max |
|
2.16 mm
|
Serial Bus Type |
|
SPI
|
Standby Current-Max |
|
0.00001 A
|
Supply Current-Max |
|
0.02 mA
|
Supply Voltage-Max (Vsup) |
|
3.6 V
|
Supply Voltage-Min (Vsup) |
|
2.3 V
|
Supply Voltage-Nom (Vsup) |
|
3 V
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Pitch |
|
1.27 mm
|
Type |
|
NOR TYPE
|
Width |
|
5.28 mm
|
Write Protection |
|
HARDWARE/SOFTWARE
|
|
|
|
Compare M25P10-AVMB3G/X with alternatives
Compare W25X80ALSSIG with alternatives