M25P05-AVMP6TG
vs
93LC66AT-I/P
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NUMONYX
MICROCHIP TECHNOLOGY INC
Part Package Code
QFP
DIP
Package Description
HVSON, SOLCC8,.25
DIP,
Pin Count
8
8
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Additional Feature
40 MHZ CLOCK FREQUENCY AVAILABLE UPON REQUEST
Clock Frequency-Max (fCLK)
25 MHz
2 MHz
Endurance
100000 Write/Erase Cycles
JESD-30 Code
R-PDSO-N8
R-PDIP-T8
Length
6 mm
9.46 mm
Memory Density
524288 bit
1024 bit
Memory IC Type
FLASH
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
65536 words
128 words
Number of Words Code
64000
128
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64KX8
128X8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
DIP
Package Equivalence Code
SOLCC8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
2.7 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
4.32 mm
Serial Bus Type
SPI
MICROWIRE
Standby Current-Max
0.000005 A
Supply Current-Max
0.015 mA
0.003 mA
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
2.3 V
1.8 V
Supply Voltage-Nom (Vsup)
3 V
2.5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Type
NOR TYPE
Width
5 mm
7.62 mm
Write Protection
HARDWARE/SOFTWARE
Base Number Matches
3
1
Pbfree Code
Alternate Memory Width
8
JESD-609 Code
e3
Screening Level
AEC-Q100
Terminal Finish
MATTE TIN
Write Cycle Time-Max (tWC)
6 ms
Compare M25P05-AVMP6TG with alternatives
Compare 93LC66AT-I/P with alternatives