M24C64-FCS6P/P vs M24C64-FCS3TP/P feature comparison

M24C64-FCS6P/P STMicroelectronics

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M24C64-FCS3TP/P STMicroelectronics

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code BGA BGA
Package Description WLCSP-8 0.50 MM PITCH, ROHS COMPLIANT, WLCSP-8
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Endurance 1000000 Write/Erase Cycles
I2C Control Byte 1010DDDR 1010DDDR
JESD-30 Code R-XBCS-B8 R-XBCS-B8
Length 1.805 mm 1.805 mm
Memory Density 65536 bit 65536 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8KX8 8KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code CSP CSP
Package Equivalence Code BGA8,3X5,44/25 BGA8,3X5,44/25
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.635 mm 0.635 mm
Serial Bus Type I2C I2C
Standby Current-Max 0.000001 A
Supply Current-Max 0.0025 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 1.4 mm 1.4 mm
Write Protection HARDWARE HARDWARE
Base Number Matches 1 1
Clock Frequency-Max (fCLK) 0.4 MHz
Write Cycle Time-Max (tWC) 10 ms

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