M24C04-DW1T
vs
AM29LV160BT-80WCF
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
SPANSION INC
|
| Part Package Code |
SOIC
|
BGA
|
| Package Description |
0.169 INCH, TSSOP-8
|
8 X 9 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48
|
| Pin Count |
8
|
48
|
| Reach Compliance Code |
compliant
|
compliant
|
| Clock Frequency-Max (fCLK) |
0.4 MHz
|
|
| Data Retention Time-Min |
40
|
|
| Endurance |
1000000 Write/Erase Cycles
|
|
| I2C Control Byte |
1010DDMR
|
|
| JESD-30 Code |
R-PDSO-G8
|
R-PBGA-B48
|
| JESD-609 Code |
e0
|
e1
|
| Length |
4.4 mm
|
9 mm
|
| Memory Density |
4096 bit
|
16777216 bit
|
| Memory IC Type |
EEPROM
|
FLASH
|
| Memory Width |
8
|
16
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
48
|
| Number of Words |
512 words
|
1048576 words
|
| Number of Words Code |
512
|
1000000
|
| Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
512X8
|
1MX16
|
| Output Characteristics |
OPEN-DRAIN
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TFBGA
|
| Package Equivalence Code |
TSSOP8,.25
|
BGA48,6X8,32
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
SERIAL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Power Supplies |
5 V
|
3/3.3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Serial Bus Type |
I2C
|
|
| Standby Current-Max |
0.000001 A
|
0.000005 A
|
| Supply Current-Max |
0.002 mA
|
0.03 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.65 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| Width |
3 mm
|
8 mm
|
| Write Cycle Time-Max (tWC) |
5 ms
|
|
| Write Protection |
HARDWARE
|
|
| Base Number Matches |
1
|
3
|
| Access Time-Max |
|
80 ns
|
| Additional Feature |
|
TOP BOOT BLOCK
|
| Alternate Memory Width |
|
8
|
| Boot Block |
|
TOP
|
| Command User Interface |
|
YES
|
| Common Flash Interface |
|
YES
|
| Data Polling |
|
YES
|
| Number of Sectors/Size |
|
1,2,1,31
|
| Programming Voltage |
|
3 V
|
| Ready/Busy |
|
YES
|
| Sector Size |
|
16K,8K,32K,64K
|
| Toggle Bit |
|
YES
|
| Type |
|
NOR TYPE
|
|
|
|
Compare M24C04-DW1T with alternatives
Compare AM29LV160BT-80WCF with alternatives