M24512-LA6 vs M24512-RBN6 feature comparison

M24512-LA6 STMicroelectronics

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M24512-RBN6 STMicroelectronics

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code SOIC DIP
Package Description LGA-8 PLASTIC, DIP-8
Pin Count 8 8
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 0.4 MHz 0.4 MHz
Data Retention Time-Min 40 40
Endurance 100000 Write/Erase Cycles 100000 Write/Erase Cycles
I2C Control Byte 1010DDDR 1010DDDR
JESD-30 Code R-PDSO-N8 R-PDIP-T8
JESD-609 Code e0 e3
Length 8 mm 9.27 mm
Memory Density 524288 bit 524288 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64KX8 64KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SON DIP
Package Equivalence Code SOLCC8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Parallel/Serial SERIAL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.14 mm 5.33 mm
Serial Bus Type I2C I2C
Standby Current-Max 0.00001 A 0.000002 A
Supply Current-Max 0.002 mA 0.001 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 1.8 V
Supply Voltage-Nom (Vsup) 5 V 2.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 5 mm 7.62 mm
Write Cycle Time-Max (tWC) 10 ms 10 ms
Write Protection HARDWARE HARDWARE
Base Number Matches 1 1

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