M1AGL600V2-CS281I
vs
AGL400V2-FFGG256
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
Package Description |
TFBGA,
|
BGA,
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
108 MHz
|
|
JESD-30 Code |
S-PBGA-B281
|
S-PBGA-B256
|
JESD-609 Code |
e0
|
e1
|
Length |
10 mm
|
17 mm
|
Number of CLBs |
13824
|
9216
|
Number of Equivalent Gates |
600000
|
400000
|
Number of Terminals |
281
|
256
|
Operating Temperature-Max |
100 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
13824 CLBS, 600000 GATES
|
9216 CLBS, 400000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
BGA
|
Package Equivalence Code |
BGA281,19X19,20
|
BGA256,16X16,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.05 mm
|
1.8 mm
|
Supply Voltage-Max |
1.575 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD SILVER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
10 mm
|
17 mm
|
Base Number Matches |
1
|
2
|
Moisture Sensitivity Level |
|
3
|
Number of Inputs |
|
178
|
Number of Outputs |
|
178
|
|
|
|
Compare M1AGL600V2-CS281I with alternatives
Compare AGL400V2-FFGG256 with alternatives