M1AGL1000V2-FGG484
vs
AGL600V2-FGG144I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-484
13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-144
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.31.00.01
Factory Lead Time
12 Weeks
8 Weeks
Clock Frequency-Max
108 MHz
108 MHz
JESD-30 Code
S-PBGA-B484
S-PBGA-B144
JESD-609 Code
e1
e1
Length
23 mm
13 mm
Moisture Sensitivity Level
3
3
Number of Equivalent Gates
1000000
600000
Number of Inputs
300
97
Number of Logic Cells
24576
13824
Number of Outputs
300
97
Number of Terminals
484
144
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
24576 CLBS, 1000000 GATES
13824 CLBS, 600000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA484,22X22,40
BGA144,12X12,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
250
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.44 mm
1.55 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
23 mm
13 mm
Base Number Matches
4
2
ECCN Code
EAR99
Compare M1AGL1000V2-FGG484 with alternatives
Compare AGL600V2-FGG144I with alternatives