M1AFS600-1FGG484YI
vs
M1AFS600-1FGG484K
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-609 Code |
e1
|
e1
|
| Moisture Sensitivity Level |
3
|
3
|
| Peak Reflow Temperature (Cel) |
250
|
250
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
3
|
3
|
| Factory Lead Time |
|
16 Weeks
|
| Clock Frequency-Max |
|
350 MHz
|
| JESD-30 Code |
|
S-PBGA-B484
|
| Number of Inputs |
|
172
|
| Number of Logic Cells |
|
13824
|
| Number of Outputs |
|
172
|
| Number of Terminals |
|
484
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
BGA
|
| Package Equivalence Code |
|
BGA484,22X22,40
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY
|
| Packing Method |
|
TRAY
|
| Qualification Status |
|
Not Qualified
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1 mm
|
| Terminal Position |
|
BOTTOM
|
|
|
|
Compare M1AFS600-1FGG484YI with alternatives
Compare M1AFS600-1FGG484K with alternatives