M1AFS600-1FGG484K
vs
M1AFS600-1FG484YK
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROSEMI CORP
|
| Package Description |
BGA, BGA484,22X22,40
|
,
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
350 MHz
|
|
| JESD-30 Code |
S-PBGA-B484
|
|
| JESD-609 Code |
e1
|
e0
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Inputs |
172
|
|
| Number of Logic Cells |
13824
|
|
| Number of Outputs |
172
|
|
| Number of Terminals |
484
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
BGA
|
|
| Package Equivalence Code |
BGA484,22X22,40
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY
|
|
| Peak Reflow Temperature (Cel) |
250
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN LEAD
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
3
|
3
|
| Rohs Code |
|
No
|
|
|
|