M1A3P600L-1FG144Y vs M1A3P600L-1FG144Y feature comparison

M1A3P600L-1FG144Y Microsemi Corporation

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M1A3P600L-1FG144Y Microsemi FPGA & SoC

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI SOC PRODUCTS GROUP
Package Description BGA, BGA144,12X12,40 BGA, BGA144,12X12,40
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 250 MHz 250 MHz
JESD-30 Code S-PBGA-B144 S-PBGA-B144
JESD-609 Code e0 e0
Moisture Sensitivity Level 3 3
Number of Inputs 97 97
Number of Logic Cells 13824 13824
Number of Outputs 97 97
Number of Terminals 144 144
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA144,12X12,40 BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Base Number Matches 3 3

Compare M1A3P600L-1FG144Y with alternatives

Compare M1A3P600L-1FG144Y with alternatives