M1A3P600-2FG256YI
vs
M1A3P600-FG144II
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
BGA
|
|
Package Description |
LBGA,
|
13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144
|
Pin Count |
256
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B144
|
JESD-609 Code |
e0
|
|
Length |
17 mm
|
13 mm
|
Moisture Sensitivity Level |
3
|
|
Number of CLBs |
13824
|
13824
|
Number of Equivalent Gates |
600000
|
600000
|
Number of Terminals |
256
|
144
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
13824 CLBS, 600000 GATES
|
13824 CLBS, 600000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
1.7 mm
|
1.55 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
17 mm
|
13 mm
|
Base Number Matches |
1
|
1
|
Clock Frequency-Max |
|
350 MHz
|
Number of Inputs |
|
97
|
Number of Outputs |
|
97
|
Package Equivalence Code |
|
BGA144,12X12,40
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare M1A3P600-2FG256YI with alternatives
Compare M1A3P600-FG144II with alternatives