M1A3P400-2FGG144 vs A3P400-2FG256 feature comparison

M1A3P400-2FGG144 Microchip Technology Inc

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A3P400-2FG256 Microchip Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 12 Weeks 8 Weeks
Clock Frequency-Max 350 MHz 350 MHz
JESD-30 Code S-PBGA-B144 S-PBGA-B256
JESD-609 Code e1 e0
Length 13 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 9216 9216
Number of Equivalent Gates 400000 400000
Number of Inputs 97 178
Number of Outputs 97 178
Number of Terminals 144 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 9216 CLBS, 400000 GATES 9216 CLBS, 400000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA144,12X12,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Packing Method TRAY TRAY
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 1.8 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 13 mm 17 mm
Base Number Matches 6 12

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