A3P400-2FG256
vs
A3P400-2FGG256I
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ACTEL CORP
|
MICROSEMI CORP
|
| Package Description |
1 MM PITCH, FBGA-256
|
BGA,
|
| Reach Compliance Code |
unknown
|
compliant
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| Length |
17 mm
|
17 mm
|
| Number of Equivalent Gates |
400000
|
400000
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
70 °C
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
400000 GATES
|
9216 CLBS, 400000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
17 mm
|
17 mm
|
| Base Number Matches |
3
|
3
|
| HTS Code |
|
8542.39.00.01
|
| Clock Frequency-Max |
|
350 MHz
|
| JESD-609 Code |
|
e1
|
| Moisture Sensitivity Level |
|
3
|
| Number of CLBs |
|
9216
|
| Peak Reflow Temperature (Cel) |
|
250
|
| Seated Height-Max |
|
1.8 mm
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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