M1A3P250-PQ208YI vs M1A3P250-2QNG132 feature comparison

M1A3P250-PQ208YI Microsemi Corporation

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M1A3P250-2QNG132 Microsemi Corporation

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description FQFP, ,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G208 S-PBCC-B132
Length 28 mm
Number of CLBs 6144
Number of Equivalent Gates 250000
Number of Terminals 208 132
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 6144 CLBS, 250000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH CHIP CARRIER
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 4.1 mm
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
Supply Voltage-Nom 1.5 V
Surface Mount YES YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form GULL WING BUTT
Terminal Pitch 0.5 mm
Terminal Position QUAD BOTTOM
Width 28 mm
Base Number Matches 3 2
Qualification Status Not Qualified

Compare M1A3P250-PQ208YI with alternatives

Compare M1A3P250-2QNG132 with alternatives