M1A3P250-PQ208YI
vs
M1A3P250-2FGG256I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Package Description
FQFP,
17 X 17 MM, 1.60 MM HEIGHT, 1.0 MM PITCH, GREEN, FBGA-256
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PQFP-G208
S-PBGA-B256
Length
28 mm
Number of CLBs
6144
Number of Equivalent Gates
250000
Number of Terminals
208
256
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
6144 CLBS, 250000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
4.1 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
Terminal Position
QUAD
BOTTOM
Width
28 mm
Base Number Matches
3
3
JESD-609 Code
e1
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
250
Qualification Status
Not Qualified
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
30
Compare M1A3P250-PQ208YI with alternatives
Compare M1A3P250-2FGG256I with alternatives