M1A3P250-PQ208 vs M1A3P250-PQG208Y feature comparison

M1A3P250-PQ208 Microsemi Corporation

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M1A3P250-PQG208Y Microsemi FPGA & SoC

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI SOC PRODUCTS GROUP
Package Description 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208 FQFP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G208 S-PQFP-G208
JESD-609 Code e0
Length 28 mm 28 mm
Moisture Sensitivity Level 3 3
Number of CLBs 6144 6144
Number of Equivalent Gates 250000 250000
Number of Inputs 151
Number of Outputs 151
Number of Terminals 208 208
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 6144 CLBS, 250000 GATES 6144 CLBS, 250000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP FQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH FLATPACK, FINE PITCH
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 4.1 mm 4.1 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 28 mm 28 mm
Base Number Matches 7 2
Part Package Code QFP
Pin Count 208
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30

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Compare M1A3P250-PQG208Y with alternatives