Findchips: Compare M1A3P1000-1FG256 vs M1A3P1000-1FGG256IY

M1A3P1000-1FG256 vs M1A3P1000-1FGG256IY feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	Yes
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	MICROSEMI CORP	MICROSEMI CORP
Package Description	BGA,	FPBGA-256
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	350 MHz	350 MHz
JESD-30 Code	S-PBGA-B256	S-PBGA-B256
Length	17 mm	17 mm
Moisture Sensitivity Level	3	3
Number of CLBs	24576
Number of Equivalent Gates	1000000	1000000
Number of Terminals	256	256
Operating Temperature-Max	85 °C	100 °C
Operating Temperature-Min		-40 °C
Organization	24576 CLBS, 1000000 GATES	1000000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	LBGA
Package Equivalence Code	BGA256,16X16,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY, LOW PROFILE
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified
Seated Height-Max	1.8 mm	1.7 mm
Supply Voltage-Max	1.575 V	1.575 V
Supply Voltage-Min	1.425 V	1.425 V
Supply Voltage-Nom	1.5 V	1.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	COMMERCIAL	INDUSTRIAL
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Width	17 mm	17 mm
Base Number Matches	3	2
Date Of Intro		2016-03-25
Additional Feature		TERM PITCH-MIN
Peak Reflow Temperature (Cel)		250
Time@Peak Reflow Temperature-Max (s)		30
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays