M1A3P1000-1FG256
vs
M1A3P1000-1FGG256Y
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI SOC PRODUCTS GROUP
Package Description
BGA,
LBGA,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of CLBs
24576
24576
Number of Equivalent Gates
1000000
1000000
Number of Terminals
256
256
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
24576 CLBS, 1000000 GATES
24576 CLBS, 1000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
1.8 mm
1.7 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
17 mm
17 mm
Base Number Matches
3
3
Part Package Code
BGA
Pin Count
256
JESD-609 Code
e1
Peak Reflow Temperature (Cel)
250
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
30
Compare M1A3P1000-1FG256 with alternatives
Compare M1A3P1000-1FGG256Y with alternatives