LXT350QE
vs
DS3150Q
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
INTEL CORP
|
DALLAS SEMICONDUCTOR
|
Part Package Code |
QFP
|
|
Package Description |
QFP, QFP44,.5SQ,32
|
PLASTIC, LCC-28
|
Pin Count |
44
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Carrier Type |
CEPT PCM-30/E-1
|
|
Carrier Type (2) |
T-1(DS1)
|
|
JESD-30 Code |
S-PQFP-G44
|
S-PQCC-J28
|
JESD-609 Code |
e0
|
|
Length |
10 mm
|
11.5062 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
44
|
28
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
QCCJ
|
Package Equivalence Code |
QFP44,.5SQ,32
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.45 mm
|
4.57 mm
|
Supply Voltage-Nom |
5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Telecom IC Type |
PCM TRANSCEIVER
|
PCM TRANSCEIVER
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
GULL WING
|
J BEND
|
Terminal Pitch |
0.8 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
10 mm
|
11.5062 mm
|
Base Number Matches |
3
|
3
|
|
|
|
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