LXT317NE
vs
UBA1707TS/C2
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
LEVEL ONE
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DIP
|
SSOP
|
| Package Description |
DIP, DIP28(UNSPEC)
|
SSOP,
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDIP-T28
|
R-PDSO-G28
|
| JESD-609 Code |
e0
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
85 °C
|
75 °C
|
| Operating Temperature-Min |
-40 °C
|
-25 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SSOP
|
| Package Equivalence Code |
DIP28(UNSPEC)
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
BICMOS
|
| Telecom IC Type |
CORDLESS TELEPHONE BASEBAND CIRCUIT
|
CORDLESS TELEPHONE SUPPORT CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
4
|
1
|
| Length |
|
10.2 mm
|
| Seated Height-Max |
|
2 mm
|
| Terminal Pitch |
|
0.65 mm
|
| Width |
|
5.3 mm
|
|
|
|
Compare LXT317NE with alternatives
Compare UBA1707TS/C2 with alternatives