LX1701ILQ
vs
NJM2149M
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
NISSHINBO MICRO DEVICES INC
|
| Part Package Code |
QFN
|
|
| Package Description |
4 X 4 MM, PLASTIC, MLPQ-16
|
DMP-8
|
| Pin Count |
16
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Bandwidth-Nom |
20 kHz
|
20 kHz
|
| Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
CLASS AB AUDIO AMPLIFIER
|
| Gain |
14 dB
|
|
| JESD-30 Code |
S-PQCC-N16
|
S-PDSO-G8
|
| JESD-609 Code |
e3
|
e6
|
| Length |
4 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
3.9 W
|
0.25 W
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
SOP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
2 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN BISMUTH
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
4 mm
|
5 mm
|
| Base Number Matches |
1
|
2
|
| Harmonic Distortion |
|
10%
|
| Supply Current-Max |
|
3.5 mA
|
|
|
|
Compare LX1701ILQ with alternatives
Compare NJM2149M with alternatives