LV8731V-MPB-H
vs
LV8731V-TLM-H
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
ONSEMI
|
| Package Description |
SSOP-44
|
SSOP-44
|
| Pin Count |
44
|
44
|
| Manufacturer Package Code |
940AF
|
940AF
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
4 Weeks
|
| Samacsys Manufacturer |
onsemi
|
onsemi
|
| Analog IC - Other Type |
STEPPER MOTOR CONTROLLER
|
STEPPER MOTOR CONTROLLER
|
| JESD-30 Code |
R-PDSO-G44
|
R-PDSO-G44
|
| JESD-609 Code |
e6
|
e6
|
| Length |
15 mm
|
15 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
44
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-20 °C
|
| Output Current-Max |
2.5 A
|
2.5 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HLSSOP
|
HLSSOP
|
| Package Equivalence Code |
SSOP44,.3
|
SSOP44,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.7 mm
|
1.7 mm
|
| Supply Current-Max (Isup) |
5 mA
|
5 mA
|
| Supply Voltage-Max (Vsup) |
32 V
|
32 V
|
| Supply Voltage-Min (Vsup) |
9 V
|
9 V
|
| Supply Voltage-Nom (Vsup) |
24 V
|
24 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BCDMOS
|
BCDMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN BISMUTH
|
TIN BISMUTH
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
5.6 mm
|
5.6 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare LV8731V-MPB-H with alternatives
Compare LV8731V-TLM-H with alternatives