LU82562V
vs
MU9C8338-TFI
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Contact Manufacturer
|
| Ihs Manufacturer |
INTEL CORP
|
MUSIC SEMICONDUCTORS INC
|
| Part Package Code |
BGA
|
QFP
|
| Package Description |
BGA,
|
QFP, QFP144,.87SQ,20
|
| Pin Count |
81
|
144
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B81
|
S-PQFP-G144
|
| JESD-609 Code |
e1
|
e0
|
| Length |
10 mm
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
81
|
144
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
QFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.815 mm
|
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
10 mm
|
|
| Base Number Matches |
1
|
1
|
| Moisture Sensitivity Level |
|
3
|
| Package Equivalence Code |
|
QFP144,.87SQ,20
|
| Supply Current-Max |
|
0.09 mA
|
| Technology |
|
CMOS
|
|
|
|
Compare LU82562V with alternatives
Compare MU9C8338-TFI with alternatives