LU82551IT
vs
GD82551IT
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
15 X 15 MM, ROHS COMPLIANT, BGA-196
|
15 X 15 MM, BGA-196
|
Pin Count |
196
|
196
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
5A991
|
5A991
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
32
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
25 MHz
|
25 MHz
|
Communication Protocol |
ASYNC, BIT
|
ASYNC, BIT; SYNC, BYTE; ETHERNET
|
Data Encoding/Decoding Method |
NRZ; NRZI; BIPH-LEVEL (MANCHESTER)
|
NRZ; NRZI; BIPH-LEVEL (MANCHESTER)
|
Data Transfer Rate-Max |
12.5 MBps
|
12.5 MBps
|
External Data Bus Width |
32
|
32
|
JESD-30 Code |
S-PBGA-B196
|
S-PBGA-B196
|
JESD-609 Code |
e1
|
e0
|
Length |
15 mm
|
15 mm
|
Low Power Mode |
YES
|
YES
|
Number of Serial I/Os |
1
|
1
|
Number of Terminals |
196
|
196
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA196,14X14,40
|
BGA196,14X14,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
1.75 mm
|
Supply Current-Max |
155 mA
|
155 mA
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
15 mm
|
15 mm
|
uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
Base Number Matches |
1
|
1
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|