LTC3872EDDB
vs
LTC3872EDDB#TRM
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
LINEAR TECHNOLOGY CORP
|
| Part Package Code |
DFN
|
SON
|
| Package Description |
3 X 2 MM, PLASTIC, MO-229WECD-1, DFN-8
|
HVSON,
|
| Pin Count |
8
|
8
|
| Manufacturer Package Code |
DDB
|
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SWITCHING CONTROLLER
|
SWITCHING CONTROLLER
|
| Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
| Input Voltage-Max |
9.8 V
|
9.8 V
|
| Input Voltage-Min |
2.75 V
|
2.75 V
|
| Input Voltage-Nom |
4.2 V
|
4.2 V
|
| JESD-30 Code |
R-PDSO-N8
|
R-PDSO-N8
|
| JESD-609 Code |
e0
|
e0
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
HVSON
|
| Package Equivalence Code |
SOLCC8,.08,20
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.85 mm
|
0.85 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
SINGLE
|
SINGLE
|
| Switching Frequency-Max |
650 kHz
|
650 kHz
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
2 mm
|
2 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
|
|
|
Compare LTC3872EDDB with alternatives
Compare LTC3872EDDB#TRM with alternatives