LTC3736EUF-2#TRPBF
vs
LTC3736EUF-2#TR
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
Package Description |
4 X 4 MM, LEAD FREE, PLASTIC, MO-220WGGD, QFN-24
|
HVQCCN,
|
Pin Count |
24
|
|
Manufacturer Package Code |
05-08-1697
|
|
Reach Compliance Code |
compliant
|
not_compliant
|
Samacsys Manufacturer |
Analog Devices
|
|
Analog IC - Other Type |
DUAL SWITCHING CONTROLLER
|
DUAL SWITCHING CONTROLLER
|
Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
9.8 V
|
9.8 V
|
Input Voltage-Min |
2.75 V
|
2.75 V
|
Input Voltage-Nom |
4.2 V
|
4.2 V
|
JESD-30 Code |
S-PQCC-N24
|
S-PQCC-N24
|
JESD-609 Code |
e3
|
e0
|
Length |
4 mm
|
4 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Output Current-Max |
1 A
|
1 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
PUSH-PULL
|
PUSH-PULL
|
Switching Frequency-Max |
825 kHz
|
825 kHz
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
Matte Tin (Sn)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
4 mm
|
4 mm
|
Base Number Matches |
1
|
2
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
|
|
|