LTC2863HDD-1#PBF
vs
LTC2863HDD-1#TRPBF
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
Package Description |
3 X 3 MM, LEAD FREE, PLASTIC, MO-229WEED-1, DFN-8
|
3 X 3 MM, LEAD FREE, PLASTIC, MO-229WEED-1, DFN-8
|
Pin Count |
8
|
8
|
Manufacturer Package Code |
05-08-1698
|
05-08-1698
|
Reach Compliance Code |
compliant
|
compliant
|
Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
Differential Output |
YES
|
YES
|
Driver Number of Bits |
1
|
1
|
Input Characteristics |
DIFFERENTIAL SCHMITT TRIGGER
|
DIFFERENTIAL SCHMITT TRIGGER
|
Interface IC Type |
LINE TRANSCEIVER
|
LINE TRANSCEIVER
|
Interface Standard |
EIA-422; EIA-485
|
EIA-422; EIA-485
|
JESD-30 Code |
S-PDSO-N8
|
S-PDSO-N8
|
JESD-609 Code |
e3
|
e3
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
HVSON
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Receive Delay-Max |
65 ns
|
65 ns
|
Receiver Number of Bits |
1
|
1
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Transmit Delay-Max |
50 ns
|
50 ns
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare LTC2863HDD-1#PBF with alternatives
Compare LTC2863HDD-1#TRPBF with alternatives