LTC1163CN8
vs
LTC1163CN8#PBF
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
LINEAR TECHNOLOGY CORP
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, DIP8,.3
|
PLASTIC, DIP-8
|
| Pin Count |
8
|
8
|
| Manufacturer Package Code |
N
|
N
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| High Side Driver |
YES
|
YES
|
| Input Characteristics |
SCHMITT TRIGGER
|
SCHMITT TRIGGER
|
| Interface IC Type |
BUFFER OR INVERTER BASED MOSFET DRIVER
|
BUFFER OR INVERTER BASED MOSFET DRIVER
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
| JESD-609 Code |
e0
|
e3
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
3
|
3
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
TOTEM-POLE
|
TOTEM-POLE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP8,.3
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.937 mm
|
3.937 mm
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Turn-off Time |
150 µs
|
150 µs
|
| Turn-on Time |
400 µs
|
400 µs
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
2
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|