Findchips: Compare LTC1155MJ8 vs LTC1155MJ8/883B

LTC1155MJ8 vs LTC1155MJ8/883B feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	No
Rohs Code	No	No
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	LINEAR TECHNOLOGY CORP	LINEAR TECHNOLOGY CORP
Part Package Code	DIP	DIP
Package Description	DIP, DIP8,.3	HERMETIC SEALED, CERDIP-8
Pin Count	8	8
Reach Compliance Code	unknown	compliant
ECCN Code	EAR99	EAR99
HTS Code	8542.39.00.01	8542.39.00.01
High Side Driver	YES	YES
Interface IC Type	BUFFER OR INVERTER BASED MOSFET DRIVER	BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 Code	R-GDIP-T8	R-GDIP-T8
JESD-609 Code	e0	e0
Moisture Sensitivity Level	1
Number of Functions	2	2
Number of Terminals	8	8
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-55 °C
Package Body Material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
Package Code	DIP	DIP
Package Equivalence Code	DIP8,.3
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	IN-LINE
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	5.08 mm	5.08 mm
Supply Voltage-Max	18 V	18 V
Supply Voltage-Min	4.5 V	4.5 V
Supply Voltage-Nom	5 V
Surface Mount	NO	NO
Technology	CMOS	CMOS
Temperature Grade	MILITARY	MILITARY
Terminal Finish	TIN LEAD	TIN LEAD
Terminal Form	THROUGH-HOLE	THROUGH-HOLE
Terminal Pitch	2.54 mm	2.54 mm
Terminal Position	DUAL	DUAL
Turn-off Time	60 µs	60 µs
Turn-on Time	1000 µs	1000 µs
Width	7.62 mm	7.62 mm
Base Number Matches	1	1
	Drivers And Interfaces » MOSFET Drivers	Drivers And Interfaces » MOSFET Drivers