LT5527EUF#PBF
vs
LT5527EUF
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
ANALOG DEVICES INC
|
Part Package Code |
QFN
|
|
Package Description |
4 X 4 MM, PLASTIC, MO-220WGGC, QFN-16
|
4 X 4 MM, PLASTIC, MO-220WGGC, QFN-16
|
Pin Count |
16
|
|
Manufacturer Package Code |
UF
|
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PQCC-N16
|
S-PQCC-N16
|
JESD-609 Code |
e3
|
e0
|
Length |
4 mm
|
4 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
250
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
RF AND BASEBAND CIRCUIT
|
RF AND BASEBAND CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
4 mm
|
4 mm
|
Base Number Matches |
1
|
4
|
ECCN Code |
|
EAR99
|
Samacsys Manufacturer |
|
Analog Devices
|
Technology |
|
BIPOLAR
|
|
|
|
Compare LT5527EUF#PBF with alternatives
Compare LT5527EUF with alternatives