LSN-1.8/10-D5H
vs
LSN-1.8/10-D5H-C
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
C&D TECHNOLOGIES INC
|
MURATA POWER SOLUTIONS INC
|
| Part Package Code |
SFM
|
SFM
|
| Package Description |
,
|
,
|
| Pin Count |
10
|
10
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Analog IC - Other Type |
DC-DC REGULATED POWER SUPPLY MODULE
|
DC-DC REGULATED POWER SUPPLY MODULE
|
| Input Voltage-Max |
5.5 V
|
5.5 V
|
| Input Voltage-Min |
4.5 V
|
4.5 V
|
| Input Voltage-Nom |
5 V
|
5 V
|
| JESD-30 Code |
R-XSMA-P10
|
R-XSMA-T10
|
| JESD-609 Code |
e0
|
|
| Load Regulation-Max |
0.25%
|
0.25%
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
10
|
10
|
| Operating Temperature-Max |
60 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Voltage-Max |
1.98 V
|
1.98 V
|
| Output Voltage-Min |
1.62 V
|
1.62 V
|
| Output Voltage-Nom |
1.8 V
|
1.8 V
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Technology |
HYBRID
|
HYBRID
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
PIN/PEG
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Trim/Adjustable Output |
YES
|
YES
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
SEATED HGT-CALCULATED
|
| Length |
|
50.8 mm
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Seated Height-Max |
|
9.14 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Total Power Output-Max |
|
18 W
|
| Width |
|
12.7 mm
|
|
|
|