LPC2210FBD144
vs
LPC2210FBD144/01,551
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
End Of Life
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFP
|
|
| Package Description |
LFQFP, QFP144,.87SQ,20
|
LFQFP,
|
| Pin Count |
144
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
ALSO REQUIRES 3.3 V SUPPLY
|
|
| Address Bus Width |
24
|
24
|
| Bit Size |
32
|
32
|
| CPU Family |
ARM7
|
|
| Clock Frequency-Max |
50 MHz
|
50 MHz
|
| DAC Channels |
NO
|
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
32
|
32
|
| JESD-30 Code |
S-PQFP-G144
|
|
| JESD-609 Code |
e3
|
|
| Length |
20 mm
|
20 mm
|
| Moisture Sensitivity Level |
2
|
|
| Number of I/O Lines |
76
|
76
|
| Number of Terminals |
144
|
144
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Equivalence Code |
QFP144,.87SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
|
| RAM (bytes) |
16384
|
|
| Seated Height-Max |
1.6 mm
|
|
| Speed |
60 MHz
|
60 MHz
|
| Supply Voltage-Max |
1.95 V
|
1.95 V
|
| Supply Voltage-Min |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
20 mm
|
20 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
7
|
1
|
|
|
|
Compare LPC2210FBD144 with alternatives
Compare LPC2210FBD144/01,551 with alternatives