LPC1114FHN33/301K vs LPC1114FHN33/201,5 feature comparison

LPC1114FHN33/301K NXP Semiconductors

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LPC1114FHN33/201,551 NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description HVQCCN, LCC33,.2SQ,20 ,
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 4 Weeks 13 Weeks
Samacsys Manufacturer NXP
Has ADC YES YES
Address Bus Width
Bit Size 32 32
Boundary Scan NO NO
CPU Family CORTEX-M0 CORTEX-M0
Clock Frequency-Max 25 MHz 25 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQCC-N33 S-PQCC-N32
Length 7 mm 7 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of I/O Lines 28 28
Number of Terminals 33 33
On Chip Data RAM Width 8 8
On Chip Program ROM Width 8 8
Operating Temperature-Max 105 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN HVQCCN
Package Equivalence Code LCC33,.2SQ,20 LCC32,.27SQ,25
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
RAM (bytes) 8192 4096
ROM Programmability FLASH FLASH
Seated Height-Max 1 mm 1 mm
Speed 50 MHz 50 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 1.8 V 3.3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7 mm 7 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1
Number of Serial I/Os 1
Number of Timers 5
ROM (words) 32768
Supply Current-Max 100 mA

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