LP8900TLX-3333 vs LP8900TLE-AAEC/NOPB feature comparison

LP8900TLX-3333 Texas Instruments

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LP8900TLE-AAEC/NOPB National Semiconductor Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC NATIONAL SEMICONDUCTOR CORP
Part Package Code BGA
Package Description VFBGA, 1.50 X 1.10 MM, ROHS COMPLIANT, MICRO, SMD-6
Pin Count 6
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Dropout Voltage1-Max 0.164 V 0.164 V
Dropout Voltage1-Nom 0.11 V 0.185 V
Dropout Voltage2-Max 0.164 V
Input Voltage-Max 5.5 V 5.5 V
Input Voltage-Min 3.3 V 3.3 V
JESD-30 Code R-PBGA-B6 R-PBGA-B6
JESD-609 Code e1 e1
Length 1.463 mm 1.463 mm
Load Regulation-Max 0.009% 0.009%
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Outputs 2 2
Number of Terminals 6 6
Operating Temperature TJ-Max 125 °C 125 °C
Operating Temperature TJ-Min -40 °C -40 °C
Output Current1-Max 0.2 A 0.2 A
Output Current2-Max 0.2 A 0.2 A
Output Voltage1-Max 2.863 V 2.863 V
Output Voltage1-Min 2.737 V 2.737 V
Output Voltage1-Nom 2.8 V 2.8 V
Output Voltage2-Max 2.863 V 1.227 V
Output Voltage2-Min 2.737 V 1.173 V
Output Voltage2-Nom 2.8 V 1.2 V
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Equivalence Code BGA6,2X3,20 BGA6,2X3,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Regulator Type FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR
Seated Height-Max 0.675 mm 0.675 mm
Surface Mount YES YES
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Voltage Tolerance-Max 2.2% 2.25%
Width 1.057 mm 1.057 mm
Base Number Matches 2 2
Adjustability FIXED
Input Voltage Absolute-Max 6.5 V
Packing Method TR
Technology CMOS

Compare LP8900TLX-3333 with alternatives

Compare LP8900TLE-AAEC/NOPB with alternatives