LP8556TME-E03/NOPB
vs
LP8556SQE-E00
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
BGA-20
|
HVQCCN,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Data Input Mode |
SERIAL
|
SERIAL
|
| Input Characteristics |
STANDARD
|
|
| Interface IC Type |
LED DISPLAY DRIVER
|
LED DISPLAY DRIVER
|
| JESD-30 Code |
R-PBGA-B20
|
S-XQCC-N24
|
| JESD-609 Code |
e1
|
|
| Length |
2.376 mm
|
4 mm
|
| Moisture Sensitivity Level |
1
|
|
| Multiplexed Display Capability |
NO
|
|
| Number of Channels |
6
|
|
| Number of Functions |
1
|
1
|
| Number of Segments |
12
|
12
|
| Number of Terminals |
20
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-30 °C
|
-30 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
VFBGA
|
HVQCCN
|
| Package Equivalence Code |
BGA20,4X5,16
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.675 mm
|
0.8 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
1.62 V
|
1.62 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
1.715 mm
|
4 mm
|
| fmax-Min |
1.25 MHz
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare LP8556TME-E03/NOPB with alternatives
Compare LP8556SQE-E00 with alternatives