LP8556SQE-E09/NOPB
vs
LP8556TME-E12/NOPB
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
WQFN-24
|
FBGA, BGA20,4X5,16
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Data Input Mode |
SERIAL
|
|
| Input Characteristics |
STANDARD
|
|
| Interface IC Type |
LED DISPLAY DRIVER
|
LED DISPLAY DRIVER
|
| JESD-30 Code |
S-XQCC-N24
|
R-PBGA-B20
|
| JESD-609 Code |
e3
|
e1
|
| Length |
4 mm
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Multiplexed Display Capability |
NO
|
|
| Number of Channels |
6
|
|
| Number of Functions |
1
|
|
| Number of Segments |
12
|
|
| Number of Terminals |
24
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-30 °C
|
-30 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
FBGA
|
| Package Equivalence Code |
LCC24,.16SQ,20
|
BGA20,4X5,16
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
|
| Supply Voltage-Max |
3.6 V
|
|
| Supply Voltage-Min |
1.62 V
|
|
| Supply Voltage-Nom |
1.8 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
MATTE TIN
|
TIN SILVER COPPER
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
4 mm
|
|
| fmax-Min |
1.25 MHz
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare LP8556SQE-E09/NOPB with alternatives
Compare LP8556TME-E12/NOPB with alternatives