LP5521YQX
vs
LP5521YQX/NOPB
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
5 X 4 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, LLP-24
|
5 X 4 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, LLP-24
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Data Input Mode |
SERIAL
|
SERIAL
|
| Interface IC Type |
LED DISPLAY DRIVER
|
LED DISPLAY DRIVER
|
| JESD-30 Code |
R-XQCC-N24
|
R-XQCC-N24
|
| JESD-609 Code |
e1
|
e1
|
| Length |
5 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Multiplexed Display Capability |
NO
|
YES
|
| Number of Functions |
1
|
1
|
| Number of Segments |
3
|
3
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-30 °C
|
-30 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC24,.16X.2,20
|
LCC24,.16X.2,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom |
3.6 V
|
3.6 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
4 mm
|
4 mm
|
| fmax-Min |
0.4 MHz
|
0.4 MHz
|
| Base Number Matches |
2
|
1
|
|
|
|