LP38691SDX-ADJ
vs
LP38691SDX-ADJ/NOPB
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
LLP-6
|
LLP-6
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Adjustability |
ADJUSTABLE
|
ADJUSTABLE
|
Dropout Voltage1-Nom |
0.5 V
|
0.5 V
|
JESD-30 Code |
S-PDSO-N6
|
S-PDSO-N6
|
JESD-609 Code |
e0
|
e3
|
Length |
3 mm
|
3 mm
|
Line Regulation-Max (%/V) |
0.1
|
0.1
|
Load Regulation-Max(%) |
2.5%
|
2.5%
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Outputs |
1
|
1
|
Number of Terminals |
6
|
6
|
Operating Temperature TJ-Max |
125 °C
|
125 °C
|
Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
Output Current1-Max |
0.5 A
|
0.5 A
|
Output Voltage1-Max |
9 V
|
9 V
|
Output Voltage1-Min |
1.25 V
|
1.25 V
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
HVSON
|
Package Equivalence Code |
SOLCC6,.13,38
|
SOLCC6,.13,38
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Packing Method |
TR
|
TR
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Regulator Type |
ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR
|
ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Matte Tin (Sn)
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.95 mm
|
0.95 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare LP38691SDX-ADJ with alternatives
Compare LP38691SDX-ADJ/NOPB with alternatives